IAM - Computational Materials Science

Cu grain growth in damascene narrow trenches

  • Autor:

    S. Maitrejean, V.  Carreau , O. Thomas, S. Labat, B. Kaouache, M.  Verdier, J. Lepinoux, Y. Brechet, M. Legros, J. Douin, S. Brandstetter, C. Cayron, O. Sicardy, D. Weygand, O. Dubreuil, S.S. Ogawa

  • Quelle:

    American Institute of Physics. AIP Conference Proceedings, Volume 1143, pp. 135-150 USA (2009)