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Ansprechpartner
Prof. Dr.-Ing. Jarir Aktaa

jarir aktaaJzg8∂kit edu

Telefon +49 721 608 24946

Joining Technologies

The research activities in this area aim at the development and optimization of joints by reducing defects and mechanical loads at the bonding interfaces and, hence, increasing strength and toughness of the joints. The main focus is on joining methods using joining temperatures considerably below the melting points of the involved base materials, e.g. brazing and solid state diffusion bonding. For joining dissimilar materials bonding methods using functionally graded material are developed in addition.

The development and optimization of joints are conducted on the base of modeling and simulation of the mechanical performance under processing and service conditions. For solid sate diffusion bonding modeling of bonding mechanisms is even performed. In addition extensive microstructural and mechanical characterizations are carried out, on the one hand to support the modeling and on the other hand to assess the bonding quality of the fabricated joints.

Stress distribution during diffusion bonding of a cooling plate
Stress distribution during diffusion bonding of a cooling plate

 

Current research projects