| Mehrkomponentenspritzgießen mit Galvanoformung als Fertigungsalternative für komplexe Mikrobauteile |
J. Prokop, C. Eberl, M. Funk,
J. Lorenz, P. Prüfe, V. Piotter,
H. J. Ritzhaupt-Kleissl |
2.Industriekolloquium der Forschergruppe 702 'Mikrobauteile', Hrsg. Erlangen : Lehrstuhl f.Kunststofftechnik, Seiten 25-35 (2010) |
| In Situ Mechanical Testing of Biological andor Inorganic Materials at the Microscale and -/Nanoscale |
C. Eberl., T. Saif |
MRS Bulletin, Band 35, Seiten 347-353 (2010) |
| In situ observations and quantitative analysis of short circuit probability due to ultra high frequency fatigue |
C. Eberl, H. Riesch-Oppermann,
R. Spolenak, F. Kubat, W. Ruile,
D. Courty, O. Kraft |
IEEE Transactions on Device and Materials Reliability, Band 99, Seiten 366-373 (2010) |
| Mechanical characterization of coatings using microbeam bending and digital image correlation techniques |
C. Eberl, D. S. Gianola,
K. J. Hemker |
Exp. Mech., Band 50, Seiten 85-97 (2010) |
| Micro- and Nanoscale Tensile Testing of Materials |
D. S. Gianola, C. Eberl |
JOM, Band 61, Seiten 24-35 (2009) |
| On the Occurrence of Portevin / Le Châtelier Instabilities in Ultrafine-Grained 5083 Aluminum Alloys |
S. P. Joshi, C. Eberl, B. Y. Cao,
K.T. Ramesh, K. J. Hemker |
Exp. Mech., Band 49, Seiten 207-218 (2009) |
| Tensile and Compressive Microspecimen Testing of Bulk Nanoporous Gold |
T. J. Balk, C. Eberl, Y. Sun,
K. J. Hemker, D. S. Gianola |
JOM, Band 61, Seiten 26-31 (2009) |
| Creep deformation mechanisms in fine-grained niobium |
A. C. Lewis, D. van Heerden,
C. Eberl, K. J. Hemker, T. P. Weihs |
Acta Mat., Band 56, Seiten 3044-3052 (2008) |
| Grain Boundary Strengthening in Copper/Niobium Multilayered Foils as a Function of Temperature and Strain Rate |
A. C. Lewis, C. Eberl,
K. J. Hemker, T. P. Weihs |
JMR, Band 23, Seiten 376-382 (2008) |
| Characterizing the microstructure and mechanical behavior of two-phase NiCoCrAlY bond coat for thermal barrier systems |
K. J. Hemker, B. G. Mendis,
C. Eberl |
Mat. Sci. Eng. A, Band 483-484, Seiten 727-730 (2008) |
| Stress-driven surface topography evolution in nanocrystalline Al thin films |
D.S. Gianola, C. Eberl,
X. M. Cheng, K. J. Hemker |
Adv. Mat., Band 20, Seiten 303-308 (2008) |
| Fatigue damage in thin film Al interconnects at ultra high frequency: a Finite Element Analysis approach |
C. Eberl, R. Spolenak, O. Kraft,
W. Ruile, E. Arzt |
Thin Solid Films, Band 515, Seiten 3291-3297 (2007) |
